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revisions ltr description date (yr-mo-da) approved a changes made in accordance with nor 5962-r275-94. 94-09-14 k. a. cottongim b changes made in accordance with nor 5962-r365-97. 97-06-19 k. a. cottongim c add device type 03, 04 and cage code 88379. correct note 1 in table i. 98-01-15 k. a. cottongim d corrections to tables i and ii. 98-05-14 k. a. cottongim e add device types 05 through 07. add case outlines t and z. table i, i ih and i il tests with notes 4 and 6, reverse the minimum and maximum limits. table i, i ih for device types 01-04 with note 6 in the conditions column, change the minimum limit from -0.2 ma to -0.4 ma. update drawing boilerplate. 02-03-13 raymond monnin f paragraph 4.2 screening: add subpar agraphs 4.2.a.3 and 4.2.c for device types 05, 06, and 07, only. table i, device types 05 through 07, change min/max test limits for v ih , v il , i ih (3 places), i il (3 places), and device types 05 and 06, change max test limits for i ee (2 places each). 02-05-24 raymond monnin rev sheet rev f f f f f f f f f f sheet 15 16 17 18 19 20 21 22 23 24 rev status rev f f f f f f f f f f f f f f of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by steve l. duncan defense supply center columbus standard microcircuit drawing checked by michael c. jones post office box 3990 columbus, ohio 43216-5000 http://www.d scc.dla.mil this drawing is available for use by all departments approved by gregory lude microcircuit, hybrid, linear, dual redundant remote terminal unit (rtu) and agencies of the department of defense drawing approval date 91-11-25 amsc n/a revision level f size a cage code 67268 5962-89798 sheet 1 of 24 dscc form 2233 apr 97 5962-e423-02 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing describes device requirements for class h hybrid microcircuits to be pr ocessed in accordance with mil-prf-38534 and a choice of case outlines and lead finishes are available and are reflected in the part or identifying number (pin). 1.2 pin . the pin shall be as shown in the following example: 5962-89798 01 x x drawing number device type case outline lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 device type(s) . the device type(s) shall identify the circuit function as follows: device type generic number circuit function 01 bus65142, bus65144 dual redundant remote terminal unit (rtu) 02 bus65143, bus65145 dual redundant remote terminal unit (rtu) 03 ct2542, ct2542-fp dual redundant remote terminal unit (rtu) 04 ct2543, ct2543-fp dual redundant remote terminal unit (rtu) 05 bu-65142x1 dual redundant remote terminal unit (rtu), +5/-15 v transceiver 06 bu-65142x2 dual redundant remote terminal unit (rtu), +5/-12 v transceiver 07 bu-65142x3 dual redundant remote terminal unit (rtu), +5/+5 v transceiver 1.2.2 case outline(s) . the case outline(s) shall be as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style t see figure 1 78 dual-in-line, ceramic, staggered pins x see figure 1 78 dual-in-line, staggered pins y see figure 1 82 flat pack z see figure 1 78 flat pack 1.2.3 lead finish . the lead finish shall be as specified in mil-prf-38534. 1.3 absolute maximum ratings . 1 / logic supply voltage (v l )........................................................... 5.5 v dc negative supply voltage (v ee ) ................................................... -18.0 v dc storage temperature ................................................................. -65 c to +150 c thermal rise, case to junction( ? t j )............................................ 13.9 c lead temperature (solderi ng, 10 seconds )................................ +300 c power dissipation (t c = +125 c)............................................... duty cycle dependent (see table i power supplies) 1.4 recommended operating conditions . logic supply voltage (v l ): device types 01 th rough 04 ................................................... +4.5 v dc to +5.5 v dc device types 05 th rough 07 ................................................... +4.75 v dc to +5.25 v dc negative supply voltage (v ee ): device types 01, 03, and 05 .................................................. -14.25 v dc to -15.75 v dc device types 02, 04, and 06 .................................................. -11.4 v dc to -12.6 v dc maximum differential i nput voltage ............................................. 40 vp-p case operating temperature range (t c )...................................... -55 c to +125 c 1 / stresses above the absolute maximum ratings may cause permanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 3 dscc form 2234 apr 97 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless ot herwise specified, the issues of these documents are those liste d in the issue of the department of defense i ndex of specifications and standards (dodi ss) and supplement thereto, cited in the solicitation. specification department of defense mil-prf-38534 - hybrid microcircu its, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-1553 - interface standard for digital time division command/response multiplex data bus mil-std-1835 - interface standard electronic component case outlines. handbooks department of defense mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specificat ion, standards, and handbooks are ava ilable from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of th is drawing and the references cited herein, the text of this drawing takes precedence. nothing in this docum ent, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item performance requirements for device class h shall be in accordance with mil-prf-38534. compliance with mil-prf-38534 may include the performance of all tests herein or as designated in the device manufacturer's quality management (qm) plan or as desi gnated for the applicable device class. therefore, the tests and inspections herein may not be performed for the applic able device class (see mil-prf-38534). furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not perform them. however, the performance requirements as defined in mi l-prf-38534 shall be met for the applicable device class. 3.2 design, construction, and physical dimensions . the design, construction, and physica l dimensions shall be as specified in mil-prf-38534 and herein. 3.2.1 case outline(s) . the case outline(s) shall be in a ccordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections and pin functions . the terminal connections and pin functi ons shall be as specified on figure 2. 3.2.3 block diagram . the block diagram shall be as specified on figure 3. 3.3 electrical perfo rmance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full specified operat ing temperature range.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 4 dscc form 2234 apr 97 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in t able ii. the electrical tests for each subgroup are defined in table i. 3.5 marking of device(s) . marking of device(s) shall be in accordanc e with mil-prf-38534. the device shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's vendor similar pin may also be marked. 3.6 data . in addition to the general performance requirements of mil-prf-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables fo rmat) from the initial quality c onformance inspection group a lot sample, for each device type listed herein. also, the data shoul d include a summary of all parameters manually tested, and for those which, if any, are guaranteed. this data shall be mainta ined under document revision level control by the manufacturer and be made available to the preparing activity (dscc-va) upon request. 3.7 certificate of compliance . a certificate of compliance shall be required fr om a manufacturer in or der to supply to this drawing. the certificate of compliance (o riginal copy) submitted to dscc-va shall a ffirm that the manufacturer's product meets the performance requirements of mil-prf-38534 and herein. 3.8 certificate of conformance . a certificate of conformance as required in mil-prf-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. quality assurance provisions 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38534 or as modified in the device manufacturer's quality management (qm) pl an. the modification in the qm plan shall not affect the form, fit, or function as described herein. 4.2 screening . screening shall be in accordance with mil-prf- 38534. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or t he acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. (2) t a as specified in accordance with table i of method 1015 of mil-std-883. (3) burn-in test shall be for 320 hours. (for device types 05, 06, and 07, only.) b. interim and final electrical test parameters shall be as spec ified in table ii herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. 100% nondestructive bond pull test. (f or device types 05, 06, and 07, only.)
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 5 dscc form 2234 apr 97 table i. electrical per formance characteristics . limits test symbol conditions 1 / -55 c t c +125 c unless otherwise specified group a subgroups device type min max unit receiver differential input impedance z in diff dc to 1 mhz 2 / 1,2,3 all 4 k ? differential input voltage v in diff 2 / 1,2,3 all 40 vp-p direct coupled (across 35 ? load) 1.2 input threshold v th transformer coupled (across 70 ? load) 4,5,6 all 0.86 vp-p common mode rejection ratio cmrr dc to 2 mhz 2 / 3 / 1,2,3 all 40 db common mode voltage cmv dc to 2 mhz 2 / 3 / 1,2,3 all -10 +10 v dc transmitter direct coupled (across 35 ? load) 6.0 9.0 differential output voltage v out diff transformer coupled (across 70 ? load) 4,5,6 all 18.0 27.0 vp-p output rise and fall time t r , t f transformer coupled (across 70 ? load) 10 to 90 percent of full waveform peak to peak. in accordance with mil-std- 1553. 9,10,11 all 100 300 ns direct coupled 5 mv rms output noise n out transformer coupled 2 / 3 / 4,5,6 all 14 mv rms logic v l = 5.5 v 01-04 2.4 high level input voltage v ih v l = 5.25 v 1,2,3 05-07 2.0 v v l = 5.5 v 01-04 0.7 low level input voltage v il v l = 5.25 v 1,2,3 05-07 0.8 v see footnotes at end of table.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 6 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / -55 c t c +125 c unless otherwise specified group a subgroups device type min max unit logic - continued. v l = 5.5 v, v ih = 2.7 v 01-04 -0.2 -0.04 ma high level input current 4 / i ih v l = 5.25 v, v ih = 2.7 v 1,2,3 05-07 -200 -50 a v l = 5.5 v, v ih = 2.7 v 6 / 01-04 -0.4 -0.02 ma 5 / -10 +10 a high level input current i ih v l = 5.25 v, v ih = 2.7 v 6 / 1,2,3 05-07 -160 -20 a v l = 5.5 v, v il = 0.4 v 01-04 -0.4 -0.08 ma low level input current 4 / i il v l = 5.25 v, v il = 0.4 v 1,2,3 05-07 -360 -100 a v l = 5.5 v, v il = 0.4 v 6 / 01-04 -0.4 -0.04 ma 5 / -10 +10 a low level input current i il v l = 5.25 v, v il = 0.4 v 6 / 1,2,3 05-07 -250 -50 a v l = 4.5 v, i oh = -0.4 ma 01-04 2.7 high level output voltage v oh v l = 4.75 v, i oh = -4.0 ma 1,2,3 05-07 4.0 v v l = 4.5 v, i ol = 2.0 ma 01-04 0.4 low level output voltage 7 / v ol v l = 4.75 v, i ol = 4.0 ma 1,2,3 05-07 0.5 v v l = 4.5 v, i ol = 4.0 ma 01-04 0.4 low level output voltage 6 / v ol v l = 4.75 v, i ol = 4.0 ma 1,2,3 05-07 0.5 v functional test 8 / 7,8 all pass/ fail input capacitance c i f = 1 mhz, t a = +25 c, see 4.3.1b 4 all 50 pf see footnotes at end of table.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 7 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / -55 c t c +125 c unless otherwise specified group a subgroups device type min max unit input/output capacitance 6 / c io f = 1 mhz, t a = +25 c, see 4.3.1b 4 all 50 pf power supplies. v l = 5.5 v dc, inputs = 0 v dc, except 12 mhz. clock input active. all outputs open 01-04 115 +5 v dc current drain i l v l = 5.25 v dc, inputs = 0 v dc, except 12 mhz. clock input active. all outputs open 1,2,3 05,06 115 ma 240 472 +5 v dc current drain - idle - 50% transmit - 100% transmit i l v l = 5.25 v dc, inputs = 0 v dc, except 12 mhz. clock input active. all outputs open 1,2,3 07 705 ma 01,03 70 05 50 01,03, 05 175 01,03 270 -15 v dc current drain - idle - 50% transmit - 100% transmit i ee v ee = -15.75 v dc 1,2,3 05 300 ma 02,04 70 06 50 02,04, 06 185 02,04 305 -12 v dc current drain 9 / - idle - 50% transmit - 100% transmit i ee v ee = -12.6 v dc 1,2,3 06 320 ma 1 / v ee = -15.0 v for device types 01, 03, and 05. v ee = -12.0 v for device types 02, 04, and 06. v l = +5.0 v, unless otherwise specified. 2 / parameter shall be tested as part of device characterization and after design and process changes and therefore shall be guaranteed to the limits specified in table i. 3 / receiver and transmitter parameters are specified with transformer. 4 / i ih and i il for input pins bro ena, addre, addrc, addra, addrd, addrb, and addrp. (these inputs have internal pull up resistors connected.) 5 / i ih and i il for all input pins other than in notes 4 and 6. 6 / i o parameters for pins db0 through db15. 7 / v oh for all output pins other than in note 6. 8 / functional tests performed to verify f unctionally to mil-std-1553 rtu protocol. 9 / the dc current drain is only tested at 50% duty cycle with a maximum limit of 130 ma.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 8 dscc form 2234 apr 97 case outline t. figure 1. case outline(s) .
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 9 dscc form 2234 apr 97 case outline t - continued. millimeters inches symbol min max min max a 5.33 0.210 ?b 0.41 0.51 0.016 0.020 d 45.72 1.800 d1 41.78 42.04 1.645 1.655 d2 37.97 38.23 1.495 1.505 e 53.34 2.100 e1 48.13 48.39 1.895 1.905 e2 45.59 45.85 1.795 1.805 e 2.54 typ 0.100 typ e1 2.41 2.67 0.095 0.105 e2 1.14 1.40 0.045 0.055 l 6.10 6.60 0.240 0.260 s 1.78 2.03 0.070 0.080 s1 1.91 typ 0.075 typ notes: 1. the u.s. preferred system of meas urement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 10 dscc form 2234 apr 97 case outline x. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 11 dscc form 2234 apr 97 case outline x - continued. millimeters inches symbol min max min max a 6.35 0.250 ?b 0.33 0.58 0.013 0.023 d 47.50 1.870 d1 41.78 42.04 1.645 1.655 d2 37.97 38.23 1.495 1.505 e 53.34 2.100 e1 48.13 48.39 1.895 1.905 e2 45.59 45.85 1.795 1.805 e 2.54 typ 0.100 typ e1 2.41 2.67 0.095 0.105 e2 1.14 1.40 0.045 0.055 l 6.10 6.60 0.240 0.260 s 2.54 3.05 0.100 0.120 s1 1.91 typ 0.075 typ notes: 1. the u.s. preferred system of m easurement is the metric si. this it em was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin 1 is indicated by either a contrasting color bead on the bottom or by esd triangle on top of the case or both. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 12 dscc form 2234 apr 97 case outline y. millimeters inches symbol min max min max a 4.72 0.186 a1 2.03 ref 0.080 ref b 0.30 0.46 0.012 0.018 c 0.20 0.30 0.008 0.012 d 40.51 40.77 1.595 1.605 e 55.50 55.75 2.185 2.195 e 1.27 typ 0.050 typ l 10.16 0.400 s1 2.41 ref 0.095 ref notes: 1. the u.s. preferred system of meas urement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 13 dscc form 2234 apr 97 case outline z. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 14 dscc form 2234 apr 97 case outline z - continued. millimeters inches symbol min max min max a 5.33 0.210 a1 2.29 2.79 0.090 0.110 a2 1.27 typ 0.050 typ a3 0.76 1.02 0.030 0.040 b 0.41 0.51 0.016 0.020 c 0.20 0.30 0.008 0.012 d 45.72 1.800 d1 46.33 1.824 d2 0.30 0.012 e 53.34 2.100 e 1.27 typ 0.050 typ l 25.40 0.600 l1 14.10 15.11 0.555 0.595 l2 10.29 11.30 0.405 0.445 notes: 1. the u.s. preferred system of meas urement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 15 dscc form 2234 apr 97 all device types terminal number case outline z case outlines t and x case outline y function description 1 1 2 a9 latched output of the most significant bit (msb) in the subaddress field of the command word. 3 2 4 a7 latched output of the third most signi ficant bit in the subaddress field of the command word. 5 3 6 a5 latched output of the least significant bit (lsb) in the subaddress field of the command word. 7 4 8 db1 bidirectional parallel data bus bit 1. 9 5 10 db3 bidirectional parallel data bus bit 3. 11 6 12 db5 bidirectional parallel data bus bit 5. 13 7 14 db7 bidirectional parallel data bus bit 7. 15 8 16 db9 bidirectional parallel data bus bit 9. 17 9 18 db11 bidirectional parallel data bus bit 11. 19 10 20 db13 bidirectional parallel data bus bit 13. 21 11 22 db15 bidirectional parallel data bus bit 15 (msb). 23 12 24 bro ena broadcast enable - when high, this input allows recognition of an rt address of all ones in the command word as a broadcast message. when low, it prevents response to rt address 31 unless it was the assigned terminal address. 25 13 26 addre input of the msb of the assigned terminal address. 27 14 28 addrc input of the 3rd msb of the assigned terminal address. 29 15 30 addra input of the 3rd msb of the assigned terminal address. 31 16 32 rtadd err output signal used to inform subsystem of an address parity error. if low, indicates parity error and the rt will not respond to any command address to a single terminal. it will still receive broadcast commands if bro ena is high. 33 17 34 txdataout b low output to the primary side of the coupling transformer that connects to the b channel of the 1553 bus. see footnotes at end of table. figure 2. terminal connections and pin functions .
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 16 dscc form 2234 apr 97 all device types terminal number case outline z case outlines t and x case outline y function description 35 18 36 n/c no connection. 37 19 38 gnd b power supply return connection for the b channel transceiver. 39 20 40 rxdatain b input from the high side of t he primary side of the coupling transformer that connects to the b channel of the 1553 bus. 78 21 81 a3 multiplexed address line output. when incmd is low, or a5 through a9 are all zeroes or a ll ones (mode command), it represents the latched output of the 2nd msb in the word count field of the command word. when incmd is high and a5 through a9 are not all zeroes or all ones, it represent s the 2nd msb of the current word counter. (see note 1). 76 22 79 a1 multiplexed address line output. when incmd is low, or a5 through a9 are all zeroes or all ones (mode command), it represents the latched output of the 2nd lsb in the word count field of the command word. when incmd is high and a5 through a9 are not all zeroes or all ones, it represent s the 2nd lsb of the current word counter. (see note 1). 74 23 77 dtgrt data transfer grant - active low input signal from the subsystem that informs the rt, when dtreq is asserted, to start the transfer. once the transfer is started, dtgrt can be removed. 72 24 75 incmd in command - high level output signal used to inform the subsystem that the rt is presently servicing a command. when low, a0-a4 (see note 1) represent the word count of the present command. when high, a0-a4 represent the cu rrent word counter of non-mode commands. 70 25 73 hs fail handshake fail - output signal that goes low a nd stays low whenever the subsystem fails to supply dtgr t in time to do a successful transfer. cleared by the next nbgt. 68 26 71 dtstr data strobe - a low level output pulse ( 166 ns ) present in the middle of every data word transfer over the parallel data bus. used to latch or strobe the data into me mory, fifos, registers, etc. recommend using the rising edge to clock data in. (see note 2). 66 27 69 dat/cmd address line output that is lo w whenever the command word is being transferred to the subsystem over the parallel data bus, and is high whenever data words are being transferred. 64 28 67 rt fail remote terminal failure - latched active low output signal to the subsystem to flag detection of a remo te terminal continuous self-test failure. also set if the watchdog tim eout circuit is activated. cleared by the start of the next message transmission (status word) and set if problem is again detected. see footnotes at end of table. figure 2. terminal connections and pin functions - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 17 dscc form 2234 apr 97 all device types terminal number case outline z case outlines t and x case outline y function description 62 29 65 dtreq data transfer request - active lo w output signal to the subsystem indicating that the rt has data for or needs data from the subsystem and requests a data transfer over the parallel data bus. will stay low until transfer is completed or transfer until transfer is completed or transfer timeout has occurred. 60 30 63 adbc accept dynamic bus control - active low input signal from subsystem used to set the dynamic bus control acceptance bit in the status register if the command word was a valid, legal mode command for dynamic bus control. 58 31 61 test 2 factory test point - do not use. (see note 3). 56 32 59 a10 latched output of the t/r bit in the command word. 54 33 57 ill cmd(me) illegal command - active low input signal from the subsystem, strobed in on the rising edge of incmd. used to define the command word as illegal and to set the message error bit in the status register. 52 34 55 ss req subsystem service request - input from the subsystem used to control the service request bit in the status register. if low when the status word is updated, the service request bit will be set; if high, it will be cleared. 50 35 53 biten built-in-test word enable - low level output pulse ( 500 ns ), present when the built-in-test word is enabled on the parallel data bus. (see note 4). 48 36 51 rxdatain a input from the low side of t he primary side of the coupling transformer that connects to the a channel of the 1553 bus. 46 37 49 v l a +5 volt input power supply connection for the a channel transceiver. 44 38 47 v ee a -15 / -12 volt input power supply connection for the a channel transceiver. (see note 7). 42 39 45 txdataout a high output to the primary side of the coupling transformer that connects to the a channel of the 1553 bus. 40 40 43 nbgt new bus grant - low level output pulse ( 166 ns ) used to indicate the start of a new protocol sequence in response to the command word just received. (see note 2). 2 41 3 a8 latched output of the 2nd msb in the subaddress field of the command word. see footnotes at end of table. figure 2. terminal connections and pin functions - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 18 dscc form 2234 apr 97 all device types terminal number case outline z case outlines t and x case outline y function description 4 42 5 a6 latched output of the 2nd lsb in the subaddress field of the command word. 6 43 7 db0 bidirectional parallel data bus bit 0 (lsb). 8 44 9 db2 bidirectional parallel data bus bit 2. 10 45 11 db4 bidirectional parallel data bus bit 4. 12 46 13 db6 bidirectional parallel data bus bit 6. 14 47 15 db8 bidirectional parallel data bus bit 8. 16 48 17 db10 bidirectional parallel data bus bit 10. 18 49 19 db12 bidirectional parallel data bus bit 12. 20 50 21 db14 bidirectional parallel data bus bit 14. 22 51 23 v l +5 volt input power supply connection for rtu digital logic section. 24 52 25 gnd power supply return for rtu digital logic section. 26 53 27 addrd input of the 2nd msb of the assigned terminal address. 28 54 29 addrb input of the 2nd lsb of the assigned terminal address. 30 55 31 addrp input of address parity bit. the combination of assigned terminal address and addrp must be odd parity for the rt to work. 32 56 33 txdataout b high, output to the primary side of the coupling transformer that connects to the b channel of the 1553 bus. 34 57 35 v ee b -15 / -12 volt input power supply connection for the b channel transceiver. (see note 7). 36 58 37 v l b +5 volt input power supply connection for the b channel transceiver. 38 59 39 rxdatain b input from the low side of primar y side of the coupling transformer that connects to the b channel of the 1553 bus. see footnotes at end of table. figure 2. terminal connections and pin functions - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 19 dscc form 2234 apr 97 all device types terminal number case outline z case outlines t and x case outline y function description 77 60 80 a2 multiplexed address line output. when incmd is low, or a5 through a9 are all zeroes or all ones (mode command), it represents the latched output of the 3rd msb in the word count field of the command word. when incmd is high and a5 through a9 are not all zeroes or all ones, it represent s the 3rd msb of the current word counter. (see note 1). 75 61 78 a0 multiplexed address line output. when incmd is low, or a5 through a9 are all zeroes or a ll ones (mode command), it represents the latched output of the lsb in the word count field of the command. when incmd is high and a5 through a9 are not all zeroes or all ones, it represents t he lsb of the current word counter. (see note 1). 73 62 76 dtack data transfer acknowledge - active low output signal during data transfers to or from the subsystem indicating the rtu has received the dtgrt in response to dtreq and is presently doing the transfer. can be connected directly to pin 63 on case z, pins 67 on cases t and x or pin 66 on case y (buf ena) for control of 3-state data buffers; and to 3-state address buffer control lines, if they are used. 71 63 74 a4 multiplexed address line output. when incmd is low or a5 through a9 are all zeroes or all ones (mode command), it represents the latched output of the msb in the word count field of the command word. when incmd is high and a5 through a9 are not all zeroes or all ones, it repres ents the msb of the current word counter. (see note 1). 69 64 72 r/w read/write - output signal that controls the direction of the internal data bus buffers. normally, the signal is low and the buffers drive the data bus. when data is needed from the subsystem, it goes high to turn the buffers around and the rt now appears as an input. the signal is high only when dtreq is active (low). 67 65 70 gbr good block received - low level output pulse ( 500 ns ) used to flag the subsystem that a valid, legal, non-mode receive command with the correct number of data words has been received without a message error and successfully transferred to the subsystem. (see note 4). 65 66 68 16 mhz 16 mhz clock input - input for the master clock used to run rtu circuits. 63 67 66 buf ena buffer enable - input used to enable or 3-state the internal data bus buffers when they are driving the bus. when low, the data bus buffers are enabled. could be connected to dtack (pin 73 case z), (pin 62, cases t and x), (pin 76, case y) if rt is sharing the same data bus as the subsystem. (see note 5). see footnotes at end of table. figure 2. terminal connections and pin functions - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 20 dscc form 2234 apr 97 all device types terminal number case outline z case outlines t and x case outline y function description 61 68 64 reset input resets entire rt when low. 59 69 62 rt flag remote terminal flag - input signal used to control the terminal flag bit in the status register. if low when the status word is updated, the terminal flag bit would be s et; if high, it would be cleared. normally connected to rtfail (pin 64, case z), (pin 28, cases t and x),( pin 67, case y). 57 70 60 test 1 factory test point - do not use. (see note 6). 55 71 58 ss busy subsystem busy - input from the s ubsystem used to control the busy bit in the status register. if low when the status word is updated, the busy bit will be set; if high, it will be cleared. if the busy bit is set in the status register, no data will be requested from the subsystem in response to a transmit command. on receive commands, data will still be transferred to subsystem. 53 72 56 ss flag subsystem flag - input from the subsystem used to control the subsystem flag bit in the status register. if low when the status word is updated, the subsystem flag will be set; if high, it will be cleared. 51 73 54 mess err message error - output signal that goes low and stays low whenever there is a format or word error with the re ceived message over the 1553 data bus. cleared by the next nbgt. 49 74 52 rxdatain a input from the high side of t he primary side of the coupling transformer that contacts to the a channel of the 1553 bus. 47 75 50 gnd a power supply return connection fo r the a channel transceiver. 45 76 48 n/c no connection. (see note 8). 43 77 46 txdataout a low output to the primary side of the coupling transformer that connects to the a channel of the 1553 bus. 41 78 44 staten status word enable - low level active output signal present when the status word is enabled on the parallel data bus. see footnotes are on next sheet. figure 2. terminal connections and pin functions - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 21 dscc form 2234 apr 97 notes: 1. device types 03 and 04: when incmd is low during the dtstr immediately following nbgt, a0 through a4 are valid and equal to wc0 through wc4 of the received command word. the remaining time while incmd is low and a5 through a9 are not all zeros or ones (i.e. mode), a0 through a4 are equal to the last current word count plus one. when incmd is high and a5 through a9 are not mode, a0 through a4 represent the current word counter. if a5 through a9 are equal to mode, a0 through a4 are equal to wc0 through wc4 of the received command word, independent of the state of incmd. 2. device type 03 and 04, pulse width is typically 125 ns. 3. pin 58 for case t, pin 31 for cases x and z, and pin 61 for case y - (test 2) factory test point output: this pin provides the output of the device bit comparison output. it indicates the loop test results for every word transmitted by the device. a test can be performed by actuating the rtu to transmit while the test fixture opens the receiver lines to force an error condition. a logi c 1 (high) indicates the loop test passed. normally this pin is left open. for device types 03 and 04, (test 2) is not implemented and should be left open. 4. device type 03 and 04, pulse width is typically 375 ns. 5. pin 63 for case t, pin 67 for cases x and z, and pin 66 for case y - buf ena: this pin is typical ly tied to dtack, causing the device to drive the s hared data bus only while dtack is ac tive. if desired buf ena can be gounded. the data will remain latched on the data bus pins for 18 s from dtsrb and 3.5 s, (device types 03 and 04 are 19 s and 4 s, respectiv ely) for the last word of a message as the devices status word or bit word is transferred to the bc (staten or biten low). once the status or bit wo rd transfer is complete, the data bus will automatically again contain the last data word. the device will automatically switch the direction of the internal buffers during a transmit operation. 6. pin 57 for case t, pin 70 for cases x and z, and pin 60 for case y - (test 1) factory test point: this test allows the user to force the active channel to tr ansmit indefinitely, in order to test the built-in watchdog timer feature of the device. when this pin is grounded and the active channel is stimulated with a valid transmit command, the device will respond with a status word and contiguous data (las t data word loaded or status word if none is loaded) until the built-in timeout occurs. normally this pin is left open or an optional pu ll-up can be used. for device types 03 and 04, (test 1) is not implemented and should be left open. 7. for device type 07, v ee a and v ee b are not connected. 8. for case y, pins 1, 41, 42, and 82 are no connections. figure 2. terminal connections and pin functions - continued.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 22 dscc form 2234 apr 97 figure 3. block diagram .
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 23 dscc form 2234 apr 97 table ii. electrical test requirements . mil-prf-38534 test requirements subgroups (in accordance with mil-prf-38534, group a test table) interim electrical parameters 1,4,9 final electrical parameters 1*,2,3,4,5,6,7,8,9,10,11 group a test requirements 1,2,3,4,5,6,7,8,9,10,11 group c end-point electrical parameters 1,2,3 end-point electrical parameters for radiation hardness assurance (rha) devices not applicable * pda applies to subgroup 1. 4.3 conformance and periodic inspections . conformance inspection (ci) and periodi c inspection (pi) shall be in accordance with mil-prf-38534 and as specified herein. 4.3.1 group a inspection (ci) . group a inspection shall be in accordance with mil-prf-38534 and as follows: a. tests shall be as specified in table ii herein. b. subgroup 4 (c i and c io measurement) shall be measured only for the in itial test and after process or design changes which may affect input and output capacitance. 4.3.2 group b inspection (pi) . group b inspection shall be in accordance with mil-prf-38534. 4.3.3 group c inspection (pi) . group c inspection shall be in accordance with mil-prf-38534 and as follows: a. end-point electrical parameters shall be as specified in table ii herein. b. steady-state life test, method 1005 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to either dscc-va or t he acquiring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. (2) t a as specified in accordance with table i of method 1005 of mil-std-883. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.3.4 group d inspection (pi) . group d inspection shall be in accordance with mil-prf-38534.
standard microcircuit drawing size a 5962-89798 defense supply center columbus columbus, ohio 43216-5000 revision level f sheet 24 dscc form 2234 apr 97 4.3.5 radiation hardness assurance (rha) inspection . rha inspection is not currently applicable to this drawing. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38534. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for gove rnment microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor- prepared specification or drawing. 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination w ill be accomplished in accordance with mil-prf-38534. 6.4 record of users . military and industrial users shall inform defens e supply center columbus when a system application requires configuration control and the applicable smd. dscc w ill maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. us ers of drawings covering micr oelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, post office box 3990, columbus, ohio 43216- 5000, or telephone (614) 692-0536. 6.6 sources of supply . sources of supply are listed in mil-hdbk- 103 and qml-38534. the vendors listed in mil-hdbk- 103 and qml-38534 have submitted a certificate of compliance (s ee 3.7 herein) to dscc-va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 02-05-24 approved sources of supply for smd 5962-89798 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38534 during the next revisions. mil-hdbk-103 and qml-38534 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accept ed by dscc-va. this bulletin is superseded by the next dated revisions of mil-hdbk-103 and qml-38534. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8979801xa 5962-8979801xa 5962-8979801xa 5962-8979801xc 5962-8979801xc 5962-8979801xc 19645 19645 19645 19645 19645 19645 bus-65142-607 bus-65142-150 bus-65142-140 bus-65142-604 bus-65142-130 bus-65142-110 5962-8979801ya 5962-8979801ya 5962-8979801yc 5962-8979801yc 19645 19645 19645 19645 bus-65144-150 bus-65144-140 bus-65144-130 bus-65144-110 5962-8979802xc 5962-8979802xc 5962-8979802ya 5962-8979802ya 5962-8979802yc 5962-8979802yc 19645 19645 19645 19645 19645 19645 bus-65143-130 bus-65143-110 bus-65145-150 bus-65145-140 bus-65145-130 bus-65145-110 5962-8979803xa 5962-8979803xc 5962-8979803ya 5962-8979803yc 88379 88379 88379 88379 ct2542 ct2542 ct2542-fp ct2542-fp 5962-8979804xa 5962-8979804xc 5962-8979804ya 5962-8979804yc 88379 88379 88379 88379 ct2543 ct2543 ct2543-fp ct2543-fp 5962-8979805ta 5962-8979805ta 5962-8979805tc 5962-8979805tc 5962-8979805za 5962-8979805za 5962-8979805zc 5962-8979805zc 19645 19645 19645 19645 19645 19645 19645 19645 bu-65142d1-150 bu-65142d1-140 bu-65142d1-130 bu-65142d1-110 bu-65142f1-150 bu-65142f1-140 bu-65142f1-130 bu-65142f1-110 see footnotes at end of table. 1 of 2
standard microcircuit drawing bulletin - continued. date: 02-05-24 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8979806ta 5962-8979806ta 5962-8979806TC 5962-8979806TC 5962-8979806za 5962-8979806za 5962-8979806zc 5962-8979806zc 19645 19645 19645 19645 19645 19645 19645 19645 bu-65142d2-150 bu-65142d2-140 bu-65142d2-130 bu-65142d2-110 bu-65142f2-150 bu-65142f2-140 bu-65142f2-130 bu-65142f2-110 5962-8979807ta 5962-8979807ta 5962-8979807tc 5962-8979807tc 5962-8979807za 5962-8979807za 5962-8979807zc 5962-8979807zc 19645 19645 19645 19645 19645 19645 19645 19645 bu-65142d3-150 bu-65142d3-140 bu-65142d3-130 bu-65142d3-110 bu-65142f3-150 bu-65142f3-140 bu-65142f3-130 bu-65142f3-110 1 / the lead finish shown for each pin representing a herme tic package is the most readily available from the manufacturer listed for that part. if the desired lead fini sh is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for it em acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address 19645 data device corporation 105 wilbur place bohemia, ny 11716-2482 88379 aeroflex laboratories, incorporated 35 south service road plainview, ny 11803-4193 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2

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